Moldability for complex parts UL recognized thermal pad for power supply,2.0mmT
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
TIF100-30-06US.pdf
TIF180-30-06US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
<Good thermal conductive:3.0W/mK
<Thickness:2.0mmT
<Hardness:18 Shore 00
<Colour: white
<RoHS compliant
<UL recognized
<Fiberglass reinforced for puncture, shear and tear resistance
Applications
<Automotive engine control units
<Telecommunication hardware
<Handheld portable electronics
<Semiconductor automated test equipment (ATE)
<CPU
<display card
Typical Properties of TIF180-30-06US |
| Product Name | TIF180-30-06US Series |
| Colour | white |
| Construction & Compostion | Ceramic filled silicone elastomer |
| Specific gravity | 3.0 g/cc |
| Thickness | 2.0mmT |
| Hardness | 18 Shore 00 |
| Dielectric constant@1MHz | 4.0 MHz |
| Continuos Use Temp | -40to 160℃ |
| Dielectric Breakdown Voltage | >5500 VAC |
| Thermal conductivity | 3.0 W/mK |
| Volume Resistiviyt | 1.0*1012 Ohm-cm |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
FAQ
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
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Power Supply 2.0mmt Cpu Thermal Pad 3.0W/MK Conductivity Images
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