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0.5~5 Mm Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink

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0.5~5 Mm Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink

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Brand Name : Ziitek

Model Number : TIF200-02E series

Certification : UL & RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-5 work days

Packaging Details : 24*13*12cm cartons

Products name : 0.5~5 Mm Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink

Feature : Soft and compressible for low stress applications

Application : GPU CPU Chip

Thickness range : 0.5~5 mm

Keywords : thermal pad

Color : Pink/ White

Hardness : 35 Shore 00

Thermal conductivity : 1.25W/m-K

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0.5~5 Mm Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink

The TIF™200-02E Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features
> Good thermal conductive: 1.25 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
0.5~5 Mm Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink
Applications
> Cooling components to the chassis of frame
> High speed mass storage drives
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook

Typical Properties of TIF200-02E Series
Color Gray / White Visual
Construction Reinforcement Carrier Ceramic filled silicone elastomer **********
Thermal Conductivity 1.25 W/mK ASTM D5470
Hardness 35 Shore 00 ASTM 2240
Specific Gravity 2.2g/cc ASTM D297
Thickness range 0.020"-0.200" (0.5mm-5.0mm) ASTM D374
Dielectric Breakdown Voltage (T= 1mm above) >5500 VAC ASTM D149
Dielectric Constant 4.0MHz ASTM D150
Volume Resistivity 1.0X10¹² Ohm-meter ASTM D257
Continuous Use Temp – 40 To 160 ℃ **********
Outgassing (TML) 0.35% ASTM E595
Flame Rating 94 V0 UL E331100

Standard Thicknesses:
0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm)

0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm)

0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

0.5~5 Mm Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile​
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


Product Tags:

heat conductive pad

      

gap filler pad

      

Laptop GPU Applicative Thermal Pad

      
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