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4.5W/MK Thermal Conductive Glue Material Conductive Epoxy Resin Potting Compound Adhesive Gel

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4.5W/MK Thermal Conductive Glue Material Conductive Epoxy Resin Potting Compound Adhesive Gel

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Brand Name : Ziitek

Model Number : TIE380-45

Certification : RoHS

Place of Origin : China

MOQ : 5kg

Payment Terms : T/T

Delivery Time : 3-8 work days

Packaging Details : 1kg/can

Products name : 4.5W/MK Thermal Conductive glue Material Conductive Epoxy Resin Potting Compound adhesive Gel Low Thermal Resistance

Feature : Heat cured epoxy adhesive

Usage : Bonding of electronics

Hardness : 92 Shore A

Chemical type : epoxy

Components : One component thermal conductive glue

Key Substrates : Metals, ceramics

Key words : Thermal Conductive glue

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4.5W/MK Thermal Conductive glue Material Conductive Epoxy Resin Potting Compound adhesive Gel Low Thermal Resistance

TIETM380-45 is a one component, heatcured epoxy adhesive. lt has excellentthermal conductivity and bond strength.

TIETM380-45 is a good choice for highspeed production lines because it hasthe rheology to allow stencil printing anda fast, one component, heat cure.

TIE380-45-TDS_EN_REV01.4.pdf

4.5W/MK Thermal Conductive Glue Material Conductive Epoxy Resin Potting Compound Adhesive Gel

Feature

> Good thermal conductive: 4.5W/mK
> Good maneuverability andadhesion performance

> Low shrinkage
> Low viscosity, easy-to-gas emissions

> Good solvent resistance, water resistance

> Longer working hours
> Excellent resistance to thermal shock

Typical Properties of TIETM380-45

Chemical type Epoxy Test Method
Appearance uncured Gray Paste Visual
Appearance cured Dull Gray Solid Visual
Components One Component *****
Heat Capacity 0.7 l/g-K ASTM C351
Key Substrates Metals, ceramics *****
Hardness 92 Shore A ASTM 2240
Continuous Use Temp -40 to 180℃ *****
Tensile strength Al/Al @25°C >2900psi *****
Thermal Conductivity 4.5 W/m-K ASTM D5470

Application Features:TIE™380-45

Color : Gray

Viscosity@25℃ : 150,000 cPs

Specific Gravity@25℃ : 2.2 g/cc

Shelf life @25℃° : 10 Days

@0℃° : 6 Months

(Storage methods and temperature will affect the shelf life)

Curing procedures:

Curing temperature Curing time

100℃° : 4 Hours

125℃ : 2 Hour

150℃ : 30 Minutes

170℃ : 5 Minutes

General package:

1kg/can

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

4.5W/MK Thermal Conductive Glue Material Conductive Epoxy Resin Potting Compound Adhesive Gel

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online


Product Tags:

Thermal Conductive Glue Material

      

Conductive Epoxy Resin Potting Compound

      

Conductive Epoxy Resin Adhesive Gel

      
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4.5W/MK Thermal Conductive Glue Material Conductive Epoxy Resin Potting Compound Adhesive Gel Images

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