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Highly Phase Change Material with 5.0 W/mK Thermal Conductivity and 50C-60C Phase Transition Temp

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Highly Phase Change Material with 5.0 W/mK Thermal Conductivity and 50C-60C Phase Transition Temp

Name: Highly Phase Change Material with 50 WmK Thermal Conductivity and 50C60C Phase Transition Temp
Brand: Ziitek
Price: 0.1 USD

Highly Phase Change Material with 5.0 W/mK Thermal Conductivity and 50C-60C Phase Transition Temp Manufactures

Brand Name : Ziitek

Model Number : TIC800G

Certification : RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-6 work days

Packaging Details : 24*23*12cm

keyword : Phase Change Material

Applicatoin : Netbook and desktop PCs

Density : 2.6 g/cc

thermal conductivity : 5.0 W/mK

phase transition temp : 50℃~60℃

material : Phase change pad

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Phase Change Material

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

The TIC™800G Series is low melting point thermal interface material. At 50℃, The TIC™800G Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance. The TIC™800G Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

TIC800G-Serice-Datasheet-REV01.pdf

Features
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required

Applications
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

Typical Properties of TIC™800G Series
Product Name	TIC^TM805G	TIC^TM808G	TIC^TM810G	TIC^TM812G	Testing standards
Color	Gray	Gray	Gray	Gray	Visual
Composite Thickness	0.005"	0.008"	0.010"	0.012”	*****
Composite Thickness	(0.127mm)	(0.203mm)	(0.245mm)	(0.305mm)	*****
Thickness Tolerance	±0.0005"	±0.0008"	±0.00010"	±0.00012"	*****
Thickness Tolerance	(±0.0127mm)	(±0.0203mm)	(±0.0254mm)	(±0.0305mm)	*****
Density	2.6g/cc				Helium Pycnometer
Work temperature	-40℃～125℃
phase transition temperature	50℃~60℃
Thermal conductivity	5.0W/mK				ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)	0.014℃-in²/W	0.020℃-in²/W	0.038℃-in²/W	0.058℃-in²/W	ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)	0.09℃-cm²/W	0.13℃-cm²/W	0.25℃-cm²/W	0.37℃-cm²/W	ASTM D5470 (modified)

Standard Thicknesses:
0.005"(0.127mm) ,0.008"(0.203mm), 0.010"(0.245mm), 0.012”(0.305mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 16"(254mm x 406mm) 16" x 400'(406mm x 121.92M)
TIC™800G series are supplied with a white release paper and a bottom liner. TIC™800G series is available in kiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series products.
Reinforcement:
No reinforcement is necessary.

Highly Phase Change Material with 5.0 W/mK Thermal Conductivity and 50C-60C Phase Transition Temp

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract

FAQ:

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

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Highly Phase Change Material with 5.0 W/mK Thermal Conductivity and 50C-60C Phase Transition Temp

Highly Phase Change Material with 5.0 W/mK Thermal Conductivity and 50C-60C Phase Transition Temp

5.0 W/mK Phase Change Material

50C-60C Phase Change Material

Highly Phase Change Material

Highly Phase Change Material with 5.0 W/mK Thermal Conductivity and 50C-60C Phase Transition Temp Images